tsv

Physical Map of RTSV, Glh in Oryza officinalis with BAC-FISH

RTSV和Glh在药用野生稻中的物理定位

互联网摘选

The methods of3D interconnection can be classified into the wire bonding, flip chip, through silicon via ( TSV) and film wire technology, whose advantages and disadvantages are analyzed.

将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。

互联网摘选

Among them, TSV is a very key process.

TSV的形成是其中很关键的一个工序。

互联网摘选

Electromagnetic transport measurements show that the thermal stability behavior for NiO being on the top of the spin valve ( TSV) is different from that for NiO being under the bottom of the spin valve ( BSV).

电磁输运测量表明，对相同Co/Cu/Co结构的自旋阀，NiO在自旋阀的顶部（TSV）和在自旋阀的底部（BSV）表现了不同的磁电阻值和热稳定特性。

互联网摘选

TSV technology mostly used the ICP-RIE process, and using MEMS technics in future main packaging would speed up MEMS industry.

TSV技术主要采用ICP-RIE工艺，将MEMS技术应用于未来的主流封装技术将会进一步加快MEMS产业的速度。

互联网摘选

Considered factors of the cost, precision control and so on, dry process is generally used to fabricate TSV.

考虑到成本，精度控制等因素，一般倾向于使用干法刻蚀来制作TSV。

互联网摘选

Theoretically , canonical truncated singular value decomposition ( TSVD ) is considered a good regularization method in solving ill-posed problems.

典则 TSVD 方法是求解线性不适定问题的一种很好的正则化方法.

互联网摘选

TSV ( Through Silicon Via) is a new interconnected technology that used in high density 3-dimensional packaging.

硅通孔（Through Silicon Via，TSV）技术是一种应用于高密度三维封装中的新兴互连技术。

互联网摘选