thermal deflection

[ˈθɜːml dɪˈflekʃn]
  • 释义

    热偏转

数据更新时间:2026-04-19 14:43:09
1、

The thermal deflection theoretical model of a piezoresistive composite micro-cantilever for thermal infrared detector was studied.

研究了一种压阻复合层微机械悬臂梁红外探测器,建立了其热挠曲理论模型.

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2、

Thermal diffusiviities of BaTiO _ 3 materials are measured by laser photothermal deflection technique.

利用激光光热偏转技术测量了钛酸钡材料的热扩散率.

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3、

Effects of slots on thermal deflection and vibration behaviors of circular saw

径向槽对锯片热变形和振动特性的影响

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4、

The main cause of thermal shock fatigue is the co-action of micro-cracks, crack bridge and deflection," crushed particles" and roughness on the crack surface during thermal shock cycling.

热震过程中的微裂纹,裂纹桥接和偏转,热震裂纹表面的碎粒及粗糙性等的共同作用是Al2O3-TiC复合陶瓷热震疲劳产生的主要机制。

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The vibration behavior and thermal deflection of the circular saw with the slots were studied with the experiment that involve to experimental mode analysis ( EMA) and simulation heating at the edge of the saw blade in this thesis.

本论文采用实验模态分析和模拟加热的实验方法对开径向槽的木工圆锯片进行了动态特性和热变形方面的研究。

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Numerical Analysis Method of Thermal Deflection and its Affection on Vibration Response of Rotor

转子热弯曲变形及其影响的数值分析方法

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9、

Silicon thin films with different structures fabricated by VHF-PECVD by using Raman scattering were studied and photo thermal deflection spectra ( PDS).

采用VHF PECVD技术制备了不同结构的Si薄膜,用喇曼(Raman)散射光谱和光热偏转谱(PDS)分别对材料的结构进行了研究。

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10、

During the thermal cycling cracks propagation, cracks deflection, bridge and pinning are the most predominant reasons that the improvement of thermal shock fatigue resistance of composites.

在热震循环裂纹扩展中,裂纹偏转、桥联和钉扎是复合陶瓷热震疲劳抗力得到改善的主要原因。

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