temperature cycling

Temperature cycling was commonly used in Sn whisker accelerated growth test.

温度循环是加速晶须生长的一种有效手段。

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Based on pressure and high low temperature cycling tests and theoretic analysis, the threaded joint parts filled with sealing glue compound show excellent seal ability, and can be applied to SRM.

通过压力、高低温循环等大量的试验和理论分析表明：采用填充密封胶的螺纹联接密封结构具有优异的密封性，适宜在固体火箭发动机环境中应用。

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Uniaxial stress and temperature cycling test

单轴应力-温度循环试验

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C-UV 9911 is used for encapsulation of IC chips as glob top with excellent temperature cycling performance.

C-UV9911可用于IC芯片的球形封装并具有极佳的温度循环性能.

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Test methods for environmental properties of optical fibres& Temperature cycling

GB/T8404.2-1987光纤的环境性能试验方法温度循环

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Design of temperature cycling detection system based on MCGS and digital temperature sensor

基于MCGS数字温度传感器的温度巡检系统设计

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Result show that IMC layer increased with the cycles, and it grew faster temperature cycling.

结果表明,随着循环周期的增加,界面IMC层 的厚度增加, 且低温极限温度越低时IMC生长 越快.

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Analysis of sress-strain in soldered joints and optimization of temperature profile of HALT thermal cycling test

焊点热应力应变分析与HALT热循环温度剖面图优化

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It shows that with the increase of the temperature cycling number, the bonding strengths of die-attachment decrease but not much.

结果表明：随着温度循环的进行，试样的粘接强度有所降低，但是并不明显。

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The thermal fatigue test was pedonned on316 SS to understand the crack propagation behavior under the cycling temperature environment.

从实用出发对316不锈钢管材进行了热循环下的裂纹扩展试验。

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Interface void damage is the failure characteristic of solder joint under temperature cycling.

温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度.

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The compose and microstructure of intermetallic compound after temperature cycling test are also observed by scanning electron microscope ( SEM).

通过扫描电镜（SEM）对温度循环试验后焊球金属间化合物（IMC）层和剪切强度试验后的断裂面进行了形貌、结构和组分的观察及分析。

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In the experiment, thermocouple temperature measurement technology was adopted to obtain the temperature cycling curve at different position feature points.

在试验中，采用热电偶测温技术，测得不同位置特征点温度循环曲线。

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Effect of temperature cycling stress profile on the thermal fatigue life of solder joints of QFP

温度循环应力剖面对QFP焊点热疲劳寿命的影响

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