packaging density

It is compact instructure, insensitive to environmental disturbance, effective in performance as well as high packaging density.

具有体积小，性能稳定及高包装密度等优点。

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The very large scale monolithic integrated circuits have already reached the limit of integration or miniaturization. If we want to raise its packaging density and expand its function further, developing the three dimensional microwave integrated circuits ( 3DMIC) is the only way.

超大规模单片集成电路已经达到其集成或微型化的极限，要进一步提高其组装密度和扩展功能，唯一的途径就是发展三维微波集成电路（3DMIC）。

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the increase of chip integration and packaging density has set higher demands on properties of electronic packaging materials.

芯片集成度的增加及封装密度的增大都对电子封装材料的性能提出了更高的要求。

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