packaging density的例句大全

The very large scale monolithic integrated circuits have already reached the limit of integration or miniaturization. If we want to raise its packaging density and expand its function further, developing the three dimensional microwave integrated circuits ( 3DMIC) is the only way.

超大规模单片集成电路已经达到其集成或微型化的极限，要进一步提高其组装密度和扩展功能，唯一的途径就是发展三维微波集成电路（3DMIC）。

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It is compact instructure, insensitive to environmental disturbance, effective in performance as well as high packaging density.

具有体积小，性能稳定及高包装密度等优点。

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in order to achieve a faster computing speed and larger storage capacity, both the chip manufacturing process and packaging density keeps improving.

为了获得更快的计算速度和更大的存储容量，芯片的制作工艺不断改进，封装密度不断提高。

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the increase of chip integration and packaging density has set higher demands on properties of electronic packaging materials.

芯片集成度的增加及封装密度的增大都对电子封装材料的性能提出了更高的要求。

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Wire loop profile and its strain, which greatly affect the density and stability of IC packaging, are determined by the capillary trajectory.

IC引线键合中，键合头的运动轨迹决定着引线轮廓的形状和内部张力，影响着封装的密集度和稳定性。

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TSV ( Through Silicon Via) is a new interconnected technology that used in high density 3-dimensional packaging.

硅通孔（Through Silicon Via，TSV）技术是一种应用于高密度三维封装中的新兴互连技术。

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technology used in electronics high density packaging

电子元器件高密度封装技术

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high density packaging technology promoted the development of testing technology

高密度封装技术推动测试技术发展

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Macromolecule Materials and Technology Used in Electronics High Density Packaging

电子元器件高密度组装中所用高分子材料及技术

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the development of high density packaging technology

高密度封装技术的发展

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With the number and density of I/ Os enlarged, CBGA and CCGA are more and more used in electronic packaging.

随着IC封装I/O端口总数及密度的增大，CBGA和CCGA的封装形式在高科技领域得到越来越多的应用。

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