temperature cycle的例句大全

After evaporator frosted, frost temperature cycle minimum value rea-ched setting lower limits and cold storage could not operate within the scope, then the cooling efficiency of the evaporator was decreased. 2.

结霜后的霜温周期最低值达到霜温设定下限，蒸发器的制冷效率下降。

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The coefficient of performance of R290/ CO_2 cascaded refrigeration cycle can be enhanced by using rotary compressor without suction and discharge valves and by replacing throttle with expander in CO_2 low temperature cycle.

在CO2循环中可利用无吸排气阀的回转式压缩机，用膨胀机代替节流阀，以提高R290/CO2复叠式制冷循环的性能系数。

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Under a temperature cycle, the dynamic response of the main beam is actually due to thermal deformation caused by temperature difference.

一个温度周期条件下的动态响应实际上是主梁截面温差引起热变形所致，动态响应的速度、加速度都很小。

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Research and Development of a Programmable Temperature Cycle Controller

可编程温度循环控制仪的研制

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Results show that GDMP can be used as treatment agent in high temperature cycle water.

结果表明，GDMP有较好的化学稳定性，且能耐较高温度，可作为高温循环水的处理药剂。

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A Damage Property Investigation of Compound Fatigue Under Temperature Cycle of the Multiple-Hole Specimen

多孔试件在热循环下的复合疲劳的损伤特性研究

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Electrostatic Precipitation, temperature cycle of design, with IP66 protection standards.

静电除尘，恒温循环设计，采用IP66防护标准。

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It was shown that its stress-rupture life is considerably reduced by the temperature cycle.

实验证明复杂温度循环可以明显降低合金的持久寿命。

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Temperature Cycle Performance of Coaxial HPGe Detector

同轴型高纯锗探测器的温度循环性能

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And, in practical projects many parts working under such moments, severe temperature cycle changes, probably cause thermal fatigue damage and destruction.

而且，在实际工程中许多零部件在工作时受到这样瞬间、剧烈的温度循环变化时，很可能导致热疲劳损伤和破坏。

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After the calibration process of this multimode measuring method, the frequency characteristic of surface resistance for testing sample can be described within one temperature cycle.

在校准步骤完成后，该多模测试方法可在一个温度循环内，对被测样品的微波表面电阻频率特性进行表征。

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A finite element modeling of SCSP was performed. The distribution of thermal stress of SCSP under temperature cycle was analyzed.

研究了温度循环载荷下叠层芯片封装元件（SCSP）的热应力分布情况，建立了SCSP的有限元模型。

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After high and low temperature cycle experiment, the parameter still can meet industry IL standard. Finally, the high temperature and humidity test is researched.

包括封装胶的选择，使得封装后的分路器经过高低温循环实验后，IL值仍然能够符合产业标准之内。最后，文章研究了PLC分路器的高温高湿实验。

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The formulation of life prediction for specified program-controlled temperature cycle is proposed. The fracture surface of the superalloy has also been observed by SEM.

提出了特定程序波温度循环预测合金断裂寿命的公式，并用扫描电镜观察了合金的断口。

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The paper uses finite element modeling to simulate the actual mount, package and temperature cycle processes of a PBGA and that strain and stress are analyzed.

用有限元数值模拟了实际微电子封装器件PBGA的部分组装、封装和热循环过程，对器件中应力应变进行分析计算。

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To ensure the accuracy, the range of the temperature cycle is divided into five phases, and the solder joints are condensed at 6 different temperatures.

为了保证计算精度将温度循环范围划分为5个阶段，因此分别在6种温度下对焊点进行静凝聚。

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This shows that in the high temperature cycle, salt, high temperature water environment and ultraviolet radiation, the bond strength of Epoxy Resin adhesive both are relatively stable.

这说明环氧树脂类粘结剂在高低温循环、盐雾、高温水环境、紫外光的照射下，其粘结强度都比较稳定。

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The COP of NH_3/ CO_2 cascaded refrigeration cycle can be enhanced largely by using expander in NH_3 high temperature cycle and CO_2 low temperature cycle.

在NH3/CO2复叠式循环的NH3高温循环和CO2低温循环中都采用膨胀机代替热力膨胀阀，可以大大地提高COP。

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Firstly, it has no need to recheck or retighten, so it can avoid loosen of connection point caused by perturbed temperature cycle and wire fracture.

首先，使用过程中它不需要重新检查或拧紧，可以有效的避免因扰动温度循环、绞线断裂等造成的接触点松动。

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Carry on temperature cycle test on typical components, inspects solder joint crack in different cycle, observe microstructure of solder joint in virtue of metallographic analyse, study solder joint failure mode in temperature cycle and offer basis to improve technology parameter.

针对典型元器件进行温度循环试验，在不同的循环周期检查焊点的开裂情况，并采用金相分析观察焊点的显微组织，分析焊点在温度循环条件下的失效模式，为改进工艺参数提供依据。

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