1、

Preparation and application of liquid photo-imageable ink for build-up multilayer board

积层线路板用液态感光成像油墨的应用研究

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2、

This article provide an method to control and improve warpage of multilayer printed board by control laminating technol-ogy.

本文从多层板层压工艺控制入手,提出了控制或改善多层板翘曲度的方法。

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3、

a special pattern is formed on an unused part 54 of the multilayer wiring board.

在多层配线基板的未使用部分(54)形成特殊图案。

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4、

current condition of build-up multilayer wiring board in application market

积层多层板应用市场的现状

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5、

guidelines for selecting core construction for multilayer printed wiring board applications

多层印制板用芯板结构选择导则

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6、

tin plating protective technology in production of multilayer printed circuit board

多层印制板生产中的电镀锡保护技术

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7、

solder coat protective technology in production of multilayer printed circuit board

多层印制板生产中的表面金属材料保护技术

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8、

the technology of laminating of multilayer printed circuit board and the methods of decreasing the warp

多层印制板层压工艺及减少翘曲产生的方法

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9、

the fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.

简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。

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10、

the analysis of the plating defect of plated through hole of the multilayer printed circuit board and countermeasure

多层印制板金属化孔镀层缺陷成因分析及相应对策

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11、

study on processing technology of step designed planar buried resistor ptfe multilayer printed circuit board

聚四氟乙烯平面埋电阻台阶式多层板制造技术研究

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12、

research of electroplating waste water from multilayer printed circuit board processing

多层印刷线路板电镀废水处理技术研究

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13、
14、

Hardware PCB ( Printed circuit board, PCB) design, equipment size and wiring requirements as full consideration in the design and signal integrity problems cascading basis, to multilayer design ( 8 layers).

硬件PCB(printed circuit board,PCB)设计,由于设备尺寸和布线要求在充分考虑层叠设计和信号完整性问题基础上,采取多层板设计(8层)。

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15、

research of multilayer printed circuit board design and manufacture technology

多层电路板快速制作工艺的研究

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16、

Automatic Routing for the Wiring of Multilayer Printed Circuit Board DBX 2

多层印制底板自动布线系统DBX2

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