the colour of sphalerite can be divided into dark-brown, red-brown and yellow-brown.

1、

a black-brown powder was synthesized from melamine ( c_3n_6h_6) by means of high temperature and high pressure.

采用高温高压方法分解缩聚三聚氰胺（C3N6H6），得到一种棕黑色粉末。

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2、

this study shows that the irregularity and process on the form of lhrh perikaryon and the brown granules of immunoreaction were filled in the cell body and process.

结果表明：LHRH核周体形态不规则，有突起，胞体和胞突内充满棕黑色的免疫反应颗粒。

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3、

when ph < 7, silver film can not be deposited at air/ solution interface, only some black powder was obtained.

当底相硝酸银溶液的pH值低于7时，在气/液界面没有银膜形成，只在银丝的尖端生成棕黑色的粉末；

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4、

it was found that the cmw with 35%~ 45% weight gain ( wg) did not melt under heat and pressure but could easily dissolve in phenol in the presence of hcl at 90~ 95 ℃ to obtain a brownish black solution.

发现增重（WG）35%～45%的CMW在加热加压下不熔融，但在HCl存在下于90～95℃易溶于苯酚获得棕黑色均一的溶液。

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5、

the article introduces theory of wave soldering. the effective way for improving the quality of wave soldering is discussed in terms of the quality control before soldering and the control of manufacturing material and process parameters.

本文介绍了波峰焊接技术的原理，并分别从焊接前的质量控制、生产工艺材料及工艺参数这三个方面探讨了提高波峰焊质量的有效方法。

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6、

measures of improving management, weldability and quality of welding is provided.

提出了强化管理，提高PCB的可焊性，提高波峰焊接质量的措施。文中特别指出波峰焊与手工焊的区别，对焊点的概念作了明确的阐述。

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7、

within the wave soldering temperature range ( 250-270 ℃), the amount of the dross is in direct proportion to the pot temperature, with rate of 50g/ ℃.

在波峰焊温度范围内（250-270℃），氧化渣量与锡炉温度成正比关系，增长率为50g/℃。

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8、

structures and materials used in lead-free wave soldering equipments were different from traditional wave soldering equipments due to characteristic of lead-free solders and fluxes.

无铅焊料和助焊剂的特性决定了无铅波峰焊设备在结构和材料选用上有很大不同。

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9、

this study benchmarked the strength of solder joints formed through the through-hole reflow process against the traditional wave soldered joint.

以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。

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10、

introduce technology characteristic of lead-free wave soldering, and introduce each subsystem of lead-free wave soldering equipment according as technology process.

介绍了无铅波峰焊工艺的特点，并从波峰焊接工艺流程分别介绍了无铅波峰焊设备的各个子系统。

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11、

apply to the high-grade circuit boards wave soldering, welding and hot dip high-grade iron tin wire.

适用于高档电路板的波峰焊、热浸焊和高档引线搪锡。

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12、

lead-free wave soldering equipment characteristic

无铅波峰焊设备的特点

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13、

activated rosin flux for wave soldering

松香型波峰焊用活性助焊剂

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14、

wave soldering experience will be preferred.

有波峰焊经验优先。

provided by jukuu

15、

wave soldering common question and solution countermeasure

波峰焊常见问题及解决对策

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16、

application of spike welding in welding technology of printed substrate with home welding machines

波峰焊在国产化焊机印刷线路板焊接工艺中的应用

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17、

suitable for reflow and wave flow solder;

适用再流焊与波峰焊；

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18、

wave soldering, compatible with lead free soldering.

波峰焊，符合无铅焊接。

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19、

causes and countermeasure of bridge phenomenon in wave soldering

波峰焊桥连产生的原因及预防措施

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20、

local debugging of the wave soldering control system.

对波峰焊控制系统进行了现场调试。

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