The research shows a thin dicing blade could be solidified within tens of second or a grinding wheel within several minutes.

1、

Dicing saw is an important process of the IC after package, its processing capacity determine the quality and quantity of chips.

而划片机是集成电路的后封装的重要一道工序，它的加工能力决定了芯片的质量和数量。

互联网摘选

2、

A Study on the Development of Dicing Blade Using Photo-curable Resin; Biaxially oriented polyester film for package

光固化树脂超薄砂轮切割锯片的研制GB/T16958-1997包装用双向拉伸聚脂薄膜

互联网摘选

3、

This makes slicing and dicing your bytecode easy.

这使对字节码的切片和切块变得容易。

互联网摘选

4、

Development of Conductive Photopolymer Resin Bond Dicing Blade

导电性光固化树脂结合剂锯片的研制

互联网摘选

5、

This paper studies a new method for developing resin bonded diamond ultrathin dicing blade based on rapid prototyping techniques.

本文以快速原型制造技术为基础，研究以光敏树脂作为结合剂的超薄金刚石切割砂轮片的快速制造技术。

互联网摘选

6、

Polyester dicing is reworked with waste PETP by chemical method.

以化学法使PETP废料再生成聚酯切片。

互联网摘选

7、

Some have questioned whether the dicing up of mortgages added any value to the economy.

有人质疑，将按揭贷款分割出售究竟给市场经济增加了什么价值。

互联网摘选

8、

The application of a servo system in the ZSH5 dicing saw was introduced.

介绍了伺服系统在砂轮划片机中的应用情况。

互联网摘选

9、

The necessity of developing full auto dicing saw is discussed according to development status of microelectronic industry.

根据微电子工业的发展现状，论述发展全自动划片机的必要性；

互联网摘选

10、

Dicing area can be washed by water directly and easily be cleaned up.

切菜区域可直接用水冲刷，清洗方便。

互联网摘选

11、

FEA of Thermal Deformation for Air Spindle of Dicing Saw

划片机气静压电主轴热变形的有限元分析

互联网摘选

12、

Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw

砂轮划片机θ向机构和传动误差分析

互联网摘选

13、

The Experimental Research of Sapphire Dicing by a UV Laser

紫外激光划切蓝宝石晶圆的试验研究

互联网摘选

14、

The system functions mainly include macro dicing, micro planning and district demolition.

该系统主要有学校宏观划片、微观规划和片区拆迁等功能。

互联网摘选

15、

The Mathematic Model Analysis On Dicing Saw's Blade Dressing

砂轮划片机刃具修整数学模型分析

互联网摘选

16、

Design and Implementation of Primary and Secondary Schools Admission Dicing System Based on Proximity Principle

基于就近原则的中小学招生划片系统设计与实现

互联网摘选

17、

Performance analysis and three-dimensional modeling of wafer dicing with diamond blade

金刚石砂轮刀片划切过程性能分析与三维建模

互联网摘选

18、

Experimental Research on Improving Properties of Composite Electroplated Diamond Dicing Blade

提高复合电沉积金刚石切割片性能的试验研究

互联网摘选

19、

The Technology Study on UV Laser Dicing High Brightness LED Wafer

高亮度LED晶圆紫外激光划片技术研究

互联网摘选

20、

This paper establish mathematic model according to Dicing Saw's cutting principle;

从划片机的划切机理出发建立数学模型；

互联网摘选