But these governmental regulations don't replace safe food handling.

1、

The metadata cache contains the full path names of directories and files as keys and metadata ( e.g.file length, last modification date, and whether the key is a file or a directory) as values.

元数据缓存器将目录和文件的路径名称保存为键，将元数据保存为值（如文件长度、最后修改时间、标记该条目是文件还是目录等）。

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2、

Most sitemap creators are web-based, and they request the URL of the website along with a few parameters such as change frequency and last modification date.

大多数站点地图创建器是基于web的，它们利用一些参数（比如说更改频率和最新修改日期）请求web站点的URL。

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3、

Optionally, you can list additional information for each URL, including its last modification date, its change frequency, an expiration date, and a priority value.

您可以选择性地为每个URL列出额外的信息，包括URL的最后修改时间、更改频率、终止日期和优先值。

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4、

A preview now shows three columns with subject, number, and last modification date.

预览现在显示三列，它们是主题、数量和最后一次修改日期。

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5、

A new column indicates the last modification date.

一个新列会指示最后的编辑日期。

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6、

Microstructure and properties of W-Cu electronic packaging materials by plasma spraying

等离子喷涂W-Cu电子封装材料的组织与性能

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7、

Fundamental study of new Si-Al electronic packaging materials

新型电子封装Si-Al合金的基础研究

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8、

Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material

退火工艺对轧制复合CPC电子封装材料性能的影响

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9、

Flip-chip bonding technology is a potential process in the electronic packaging.

凸点芯片倒装焊接是一种具有发展潜力的芯片互连工艺技术。

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10、

Study on the Process of Cu/ Mo/ Cu Composite for Electronic Packaging

电子封装用Cu/Mo/Cu复合材料的工艺研究

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11、

Study on Manufacturing Aluminium Matrix Composites for Electronic Packaging Using Vacuum Pressure infiltration Casting

真空压渗铸造铝基电子封装复合材料研究

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12、

The high reliability and low cost will lead thedevelopment of the electronic packaging.

集成电路封装的发展方向是高密度、低成本和高可靠性。

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13、

Overview on Solder Joint Shape Prediction Technology in Electronic Packaging

电子封装软钎焊焊点形态预测技术研究现状

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14、

Power injection molding of mo/ cu alloy for electronic packaging

电子封装用注射成形Mo/Cu合金烧结工艺的研究

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15、

Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials

压制压力对Si-Al电子封装材料性能的影响

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16、

Morphology of the water in plastic electronic packaging materials

电子封装塑封材料中水的形态

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17、

The present situation of lead-free system in electronic packaging

电子封装无铅化现状

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18、

New Progress of Electronic Packaging Technology

电子封装技术的新进展

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19、

Recent achievements in research for electronic packaging substrate materials

电子封装基片材料研究进展

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20、

Therefore, it is very important to investigate the reliability of electronic packaging.

因此，对电子封装可靠性的分析非常重要。

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