wave soldering的例句大全

Familiar Wave soldering process. Familiar with assembly and packing process.

熟悉波峰焊制程, 熟悉组装和包装制程.

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11950s: mass soldering for Through Hole Technology ( THT)& wave soldering appeared;

1950年代：通孔插装的群焊技术&波峰焊技术出现；

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Through hole filling is always a big challenge for wave soldering in multilayer PCB assembly, especially when encountering thick boards or components with large thermal dissipation.

钎料的通孔填充性问题一直是无铅波峰焊工艺在焊接双面板或多层板时一个很大的挑战，特别是遇到大厚板或者存在大吸热元件时填充不良现象尤为严峻。

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Ultrasonic welding of integrated circuits is of highest accurate. WS Wave Soldering

超声波焊接的集成电路，精密度极高。波峰焊接，THT元件的焊接方式

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Present Situation and Green Design of Wave Soldering

波峰焊接技术现状及绿色化设计方向

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Operating under the temperature for wave soldering, Fe and Sn can react and create acicular brittle compound whose major element is FeSn_2. The development of compound is not a balanceable process.

波峰焊工作温度下Fe、Sn能反应生成主要为FeSn2的脆性针状化合物。

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Wave soldering machine operators ( in 9483 Electronics Assemblers, Fabricators , Inspectors and Testers ).

波峰焊机器操作员 ( 9483电子装配, 检查员, 及测试员 ).

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comparison for wave soldering machine of using mechanical pump and magnetic induction pump

机械泵与感应电磁泵波峰焊机的比较与分析

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analysis of the soldering quality of the doubled- wave soldering machine and the methods of improving

提高双波峰焊机焊接质量的分析及方法

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lead- free wave soldering, wave soldering wave peak welding machines, reflow soldering machine .

无铅波峰焊，波波峰焊，峰焊接机，回流焊接机。

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in the paper all the processes of lead-free wave soldering were analyzed, a great deal of experiments were done by doe, many of soldering defects due to process were analyzed by spc and the best lead-free wave soldering processes were made.

通过分析无铅波峰焊接的各个工艺参数，运用DOE方法进行大量的试验，采用统计学原理分析产生各种缺陷的工艺因素，并确定优化的无铅波峰焊接工艺。

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there are two important characteristics in wave soldering with pb-free solders, the using high sn-content solder and the higher soldering temperature than the traditional sn-pb solder.

无铅钎料的波峰焊有2个重要特点，钎料中Sn含量很高以及钎焊温度明显高于传统的Sn-Pb钎料。

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establishment and analysis of wave soldering solder joints finite element model

波峰焊焊点有限元模型的建立与分析

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wave soldering technology and equipment for pb-free solders& challenge and countermeasure

无铅钎料的波峰焊工艺与设备&挑战与对策

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within the wave soldering temperature range ( 250-270 ℃), the amount of the dross is in direct proportion to the pot temperature, with rate of 50g/ ℃.

在波峰焊温度范围内（250-270℃），氧化渣量与锡炉温度成正比关系，增长率为50g/℃。

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the article introduces theory of wave soldering. the effective way for improving the quality of wave soldering is discussed in terms of the quality control before soldering and the control of manufacturing material and process parameters.

本文介绍了波峰焊接技术的原理，并分别从焊接前的质量控制、生产工艺材料及工艺参数这三个方面探讨了提高波峰焊质量的有效方法。

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the paper introduces the design of the control system of wave soldering machine and its controller.

本文介绍了波峰焊控制系统的总体设计和控制器的开发，并且在文中重点对基于继电反馈的PID控制参数自整定算法及纯滞后补偿控制算法进行了深入的研究。

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the lift-off phenomenon in through-hole wave soldering with sn-ag-cu-bi solder was investigated by the simulation experiment.

采用在波峰焊过程中常用的Sn-Bi-Ag-Cu无铅钎料，进行了通孔波峰焊焊点剥离现象模拟实验。

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development and environmental protection of induced electromagnetic pump wave soldering

感应式电磁泵波峰焊技术的发展及对环境保护

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local debugging of the wave soldering control system.

对波峰焊控制系统进行了现场调试。

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