tin plating的例句大全

A new methane sulfonic acid electroless tin plating technology aras investigated.

研究了一种新型甲烷基磺酸化学镀锡工艺.

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High stable acid bright tin plating process ( nu bri& tin process)

宽温高稳定系列酸性光亮镀锡工艺（NUBr-tin工艺）

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Gavenized sheet steel and tin plating, divided into hot dip galvanised Tin plate and tinpalte.

镀锡不厚钢不活又以镀锡工艺的不差别, 分为寒沉镀锡不活和电镀镀锡不活两栽.

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A new method for the determination of sodium stannate in alkaline tin plating baths was advanced.

提出了一种新的测量碱性镀锡液中锡酸钠含量的方法.

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0.05 to 0.1 grams per liter rare earth catalyst was added in acid tin plating bath. Bath stability was studied by accelerated oxidation test and exposure test.

在镀锡液中加入005～01g/L稀土催化剂，通过加速氧化试验和空气暴露试验研究了镀锡液的稳定性。

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Some technical innovations inspired from practice Part ⅴ& Removal of copper impurity from acidic bright tin plating bath

实践逼出来的点滴创新第五部分&光亮酸性镀锡液中铜杂质的去除

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Itinerant Inspection of Tin Plating Production Line for Copper Coated Steel Wire

镀铜钢丝镀锡生产线中的巡回检查

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tin plating protective technology in production of multilayer printed circuit board

多层印制板生产中的电镀锡保护技术

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Describes the process, operating hints for crystal-tin plating and stripping of the defective films.

阐述冰花镀锡的工艺流程 、 要点,以及不良镀层的退除.

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Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced.

介绍了晶纹镀锡中重熔工序的操作要点和安全要求.

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A Comparison on Several Stabilizing Agents in Acidic Tin Plating Bath

酸性镀锡液稳定剂的优选

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the invention relates to a piston ring and a surface spongy tin plating technique thereof.

一种活塞环及其表面松孔镀锡工艺。

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Factors Affecting lodine Titrimetric Analysis of Sn(ⅱ) in Acid Tin Plating Bath

碘量法测定酸性镀锡液中Sn（Ⅱ）含量的影响因素

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A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.

采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。

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Effects of Pulse Bias on TiN Coating in Arc Ion Plating

电弧离子镀技术中脉冲偏压对TiN薄膜的影响

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Oxidation properties of tin coating by ion plating at high temperature

离子镀TiN涂层的高温氧化特性

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Deposition mechanism of electroless plating tin in acid chloride solutions was analyzed theoretically, and three steps were summed up, including period of replacement reaction, coexistence periods of copper-tin codeposition and self-catalyzed deposition, and period of self-catalyzed deposition.

从理论上系统地分析了酸性氯化物化学镀锡的沉积机理，将其归纳为置换反应期、铜锡共沉积与自催化沉积共存期和自催化沉积期三个阶段。

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Immersion plating of copper-tin alloy on steel and iron

钢铁浸镀铜锡合金工艺研究

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The extra-thin copper film wrapped diamond nanoparticles were prepared by using electroless plating method under the condition of tin chloride sensitization and palladium chloride activation.

在氯化亚锡敏化、氯化钯活化的条件下，通过化学镀方法，成功地在纳米金刚石粉体表面制备了超薄铜膜。

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The influence of the activating source power on tin coatings deposited on the matrix of HSS by reactive sputtering ion plating

活化源功率对高速钢基体反应溅射离子镀TiN涂层的影响

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