1、

This technology can be widely used for chip encapsulation in the field of micro-electronics. The core of this technology is that it achieves a vision machine to automatically recognize and locate the bonding pad on the unencapsulated semiconductor chip.

这一技术可以广泛应用于微电子行业中的芯片封装技术,它的核心是实现了对未封装的半导体芯片上的焊盘进行识别并定位的视觉机器。

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2、

SEM analysis of cross sections for semiconductor chip

半导体芯片截面的扫描电镜分析

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3、

DRAM is a semiconductor chip used in most electronic products such as personal computers.

动态随机存取记忆体是应用于电子产品的半导体晶片,如个人电脑等。

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4、

at least a semiconductor chip (such as a microphone chip) is arranged on the base part and right over the shield plate.

至少一个半导体芯片(例如麦克风芯片)安装在基座部上并且在屏蔽板的正上方。

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5、

Fixed abrasive wire is considered as one of the most promising methods in slicing of large size semiconductor chip and function crystal because of its incomparable advantages.

在大尺寸半导体基片和功能晶体的切割中,固结磨料线锯以无可比拟的优点被认为是最有前途的切割方法之一。

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6、

Four silicon chip resistors are produced in different directions using semiconductor Planar process, and connected into a Wheatstone e-bridge.

利用半导体平面工艺在单晶硅片的不同方向上制作出四个电阻,并连接成一个惠斯通电桥。

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7、

A method of extending and connecting for semiconductor memory integrated chip

半导体存储器集成芯片的扩展连接方法

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8、

The project of the calendar 1C in our VLSI Design Center is to develop a typical large scale integrate circuit chip for a HongKong semiconductor. industry company, is the first commercial VLSI product with our own independent property rights which has a wide market perspective.

万年历电路芯片项目的内容是由我们VLSI设计中心为香港某半导体工业公司开发一块数字大规模集成电路,该芯片是本设计中心第一块拥有独立产权的具有广阔市场前景的商业化产品。

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9、

Kuo says that Taiwan Semiconductor Manufacturing Company ( TSMC), Apple's chip manufacturer, stands to benefit enormously from Apple's plans.

郭明錤表示,作为苹果的芯片制造商,台湾半导体制造公司台积电(TSMC),将从苹果的计划中获得很大的好处。

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10、

True story: In 1986, when Japan ruled the semiconductor market, Barrett learned everything he could about Japanese manufacturing practices. He applied what he learned at Intel's chip-fabrication plants.

真实故事:1986年,当日本占领了半导体市场时,克雷格?巴雷特从日本公司学到了有关的生产时间经验,随后他将这些经验应用到芯片的制作和生产中。

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11、

Intel is consolidating its semiconductor testing and packaging operations, the most labour-intensive part of chip production, in Chengdu in the province of Sichuan to cut costs, a move that will erase 2,000 jobs at the chipmaker's Shanghai plant.

英特尔(Intel)正将芯片制造过程中劳动力最密集的环节&半导体测试和封装业务,集中到四川成都进行,以节省成本。此举意味着该芯片制造商上海工厂的2000个职位将不保。

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12、

Mr Chang said on Thursday that the era of rapid growth for the chip industry had ended in 2000, although the foundry sector is still expected to slightly outperform the overall semiconductor industry.

张忠谋周四表示,芯片业快速增长的时代在2000年已经结束,不过预计代工产业仍将略好于半导体产业的总体表现。

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13、

Progress on NSFC major research plan "semiconductor integrated system on a chip"

半导体集成化芯片系统基础研究重大研究计划进展综述

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14、

Package and Electrostatic Discharge Failure Analysis of Power Semiconductor Device Chip

功率器件芯片封装和静电放电失效分析

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15、

Ultrasonic Wire welding machine is used in semiconductor manufacturing processes which welding the chip and pin outside the framework.

超声波铝丝焊接机是运用于半导体生产工序中晶片与引脚外框架间引线的焊接的设备。

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16、

The industry and market needs to promote the performance of electronic systems. As the semiconductor technology advances, the on-chip clock speed and board-level clock speed increases yearly. High-speed circuit bandwidth has accessed to the traditional circuit microwave frequency bands.

需求不断地推动着电子学系统的性能发展,随着半导体工艺的进步,片上时钟的速度和板级时钟的速度都在逐年提高,信号的带宽已经进入了传统的微波电路的频带范围。

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17、

power semiconductor device chip manufacturing process is actually repeated several times on film formation, lithography and doping process in a substrate, and its primary task is to solve the problem of film formation.

功率半导体器件芯片制造过程中实际上就是在衬底上多次反复进行的薄膜形成、光刻与掺杂等加工过程,其首要的任务是解决薄膜制备问题。

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18、

tool shipments are running at a rate suggesting annual semiconductor capital spending of$ 40bn to$ 50bn, a level that has tended to cause meaningful rises in chip manufacturing capacity in the past.

以目前半导体设备的出货量计算,半导体行业的年度资本支出将达到400亿至500亿美元,在过去,这一支出水平往往表明,芯片制造产能将出现大幅度的增长。

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19、

during the past year, qualcomm has partnered with the chinese chip maker semiconductor manufacturing international to develop advanced chip production;

过去一年里,高通(Qualcomm)与中国芯片制造商中芯国际(Semiconductor Manufacturing International)合作开发先进芯片生产;

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20、

china's leading chip maker semiconductor manufacturing international corporation ( smic) has inked an agreement with the municipal government of shenzhen to build a chip-making plant in the city.

中国领先的芯片制造商中芯国际集成电路制造有限公司(中芯国际)已与深圳市政府签署协议,将在该市建设一家芯片制造厂。

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