packaging material的例句大全

The cushion packaging material was mainly composed of straw, apple waste, and starch additive. The technology of expanding and press molding was applied to produce this naturally degradable material and does not contaminate the environment.

该缓冲包装材料是以秸秆、果渣及淀粉添加剂为主要原料，利用膨化技术及压模成型原理制出的一种新型的可自然降解，对环境无污染的缓冲材料。

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Gree Package Guide the Development Direction of Packaging Material and Machinery

绿色包装指导包装材料、包装机械发展方向

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The technology of making foaming buffer packaging material with wastepaper and starch was studied.

研究了以废纸为原料，以淀粉为粘合剂的发泡包装缓冲材料的制造工艺。

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Metal Matrix composites ( MMC) have received substantial attention as Electronic Packaging Material, because of theirs properties: high thermal conductivity and low coefficient of thermal expansion.

金属基复合材料作为电子封装材料，具有高导热、低膨胀的特点。

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Research Progress in Thermal Conductivity and Sintering Additives of AlN Packaging Material

AlN陶瓷基板材料热导率与烧结助剂的研究进展

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Processing Technology of High Water Resistance Paper Packaging Material with Composite Structure

具有复合结构的高耐水性包装纸材加工技术研究

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The effect of packaging material and technology on fresh mutton was discussed.

论述了包装材料和包装工艺对新鲜羊肉货架寿命的影响。

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Automatic Rectification of Rewinding Packaging Material Based on Digital Image Processing

基于数字图像处理的卷筒包装材料自动纠偏

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They are mainly for the rolling hexagon cylinder experiment, the press test and the stretch test of the packaging material.

主要用于运输包装件的六角滚筒实验、抗压力实验，包装材料的拉力实验。

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THE COLORANT OF POLYMER MELT OF FOOD PACKAGING MATERIAL ── The Study of the Heat Resistant Food Pigment

聚合物食用包装材料熔体着色剂&耐热性食用颜料的研制

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Anti-static of Barrier Packaging Material

阻隔包装材料静电防护

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Studies show that water vapor quickly permeates plastic packaging material.

研究证明水蒸汽能迅速渗入塑料封装材料。

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The production and application of photoresist, specialty chemicals for flat panel display, printed circuit board material, high-purity reagent, specialty gas and packaging material in China were summarized. At present, 1000 electronic chemicals can be produced in China in commercial scale or in batches.

综述了我国光刻胶、FPD专用化学品、印刷电路板材料、高纯试剂、电子特种气体和封装材料的生产和应用现状，目前我国能工业化生产或批量生产的电子化学品近1000种。

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The Ft thin film temperature Sensor design. technological process. Pt-film, Substrate and packaging material and their relationship have been discussed.

本文讨论了铂薄膜温度传感器的设计、制造工艺、膜料与衬底及封装材料的关系。

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Dynamic Characteristic Research of EPS Shockproof Packaging Material of Belt Structure

带结构的EPS防震包装材料动特性研究

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Theoretical and experimental investigation of EPS shockproof packaging material of belt structure is carried on.

对带结构的EPS防震包装材料进行了理论和试验研究。

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Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material

退火工艺对轧制复合CPC电子封装材料性能的影响

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The relation between different packaging materials and customer's emotional appeal, and the skin texture structure and tactility characteristic of different material was introduced.

反映了不同触感的包装材料对人们消费心理产生不同的影响。

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Study on Making Buffer Packaging Material by Wastepaper

用废纸制取包装缓冲材料的研究

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The Application and Prospect of Green Packaging Material Technology

绿色包装材料和技术的应用及展望

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