electronic packaging的例句大全

New Progress of Electronic Packaging Technology

电子封装技术的新进展

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With the development of electronic packaging technology, packaging pin number increasing, lead spacing smaller, encapsulated in the substrate of the area will be smaller.

随着电子封装技术的发展，封装引脚数越来越多，引线间距越来越小，封装体在基板上所占的面积也会更小。

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Metal Matrix composites ( MMC) have received substantial attention as Electronic Packaging Material, because of theirs properties: high thermal conductivity and low coefficient of thermal expansion.

金属基复合材料作为电子封装材料，具有高导热、低膨胀的特点。

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Theoretical Arithmetic and Optimum Design for the 0-3 Electronic Packaging Composites

0-3型复合电子封装材料的理论计算与优化设计

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A Study on Interface Failure Analysis and Reliability for High Temperature Electronic Packaging

高温电子封装界面失效分析及可靠性研究

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The development of materials and technology of electronic packaging

电子封装材料及其技术发展状况

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Optimal design of plastic electronic packaging component based on BP neural network

基于BP神经网络的模塑封电子器件优化设计

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Research on High Performance Novel Electronic Packaging Materials of Silicon-based Aluminum

新型硅基铝金属高性能电子封装复合材料研究

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Chance and challenge of electronic packaging in China in 21 century

21世纪我国电子封装行业的发展机遇与挑战

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Study on the Thermal Failure of Metal Substrates in Electronic Packaging

电子封装技术中金属基板结构的热失效行为研究

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Current Status of Research on Electronic Packaging Materials

电子封装材料的研究现状

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The Application of Several Electronic Packaging Technologies in Portable Electronics Products

几种电子封装技术在便携式电子产品中的应用

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Application of the New Material in High-Density Electronic Packaging and its Prospect

浅析新材料在高密度电子封装上的应用及发展前景

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Research and Application of Copper Bonding Wire in Electronic Packaging

电子封装Cu键合丝的研究及应用

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The conversion to lead free is the trend in electronic packaging technology.

电子产品向无铅化转变是大势所趋。

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Recent advances in the study of moisture absorption in plastic electronic packaging

吸收湿气对微电子塑料封装影响的研究进展

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The New Generation of Green Electronic Packaging Materials

新一代绿色电子封装材料

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Therefore, it is very important to investigate the reliability of electronic packaging.

因此，对电子封装可靠性的分析非常重要。

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Recent achievements in research for electronic packaging substrate materials

电子封装基片材料研究进展

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The present situation of lead-free system in electronic packaging

电子封装无铅化现状

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