electronic packaging的例句大全

Chance and challenge of electronic packaging in China in 21 century

21世纪我国电子封装行业的发展机遇与挑战

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Study on the Thermal Failure of Metal Substrates in Electronic Packaging

电子封装技术中金属基板结构的热失效行为研究

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Current Status of Research on Electronic Packaging Materials

电子封装材料的研究现状

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The Application of Several Electronic Packaging Technologies in Portable Electronics Products

几种电子封装技术在便携式电子产品中的应用

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Application of the New Material in High-Density Electronic Packaging and its Prospect

浅析新材料在高密度电子封装上的应用及发展前景

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With the development of electronic packaging technology, packaging pin number increasing, lead spacing smaller, encapsulated in the substrate of the area will be smaller.

随着电子封装技术的发展，封装引脚数越来越多，引线间距越来越小，封装体在基板上所占的面积也会更小。

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The conversion to lead free is the trend in electronic packaging technology.

电子产品向无铅化转变是大势所趋。

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Recent advances in the study of moisture absorption in plastic electronic packaging

吸收湿气对微电子塑料封装影响的研究进展

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The New Generation of Green Electronic Packaging Materials

新一代绿色电子封装材料

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Therefore, it is very important to investigate the reliability of electronic packaging.

因此，对电子封装可靠性的分析非常重要。

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Recent achievements in research for electronic packaging substrate materials

电子封装基片材料研究进展

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New Progress of Electronic Packaging Technology

电子封装技术的新进展

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The present situation of lead-free system in electronic packaging

电子封装无铅化现状

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Morphology of the water in plastic electronic packaging materials

电子封装塑封材料中水的形态

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Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials

压制压力对Si-Al电子封装材料性能的影响

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Power injection molding of mo/ cu alloy for electronic packaging

电子封装用注射成形Mo/Cu合金烧结工艺的研究

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Overview on Solder Joint Shape Prediction Technology in Electronic Packaging

电子封装软钎焊焊点形态预测技术研究现状

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The high reliability and low cost will lead thedevelopment of the electronic packaging.

集成电路封装的发展方向是高密度、低成本和高可靠性。

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Study on Manufacturing Aluminium Matrix Composites for Electronic Packaging Using Vacuum Pressure infiltration Casting

真空压渗铸造铝基电子封装复合材料研究

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Study on the Process of Cu/ Mo/ Cu Composite for Electronic Packaging

电子封装用Cu/Mo/Cu复合材料的工艺研究

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