1、

ptee woven glass fabric copper clad laminate

覆铜箔聚四氟乙烯玻璃布层压板

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2、

copper clad steel coil produced by inversion casting

铜-钢反向凝固复合带的实验研究

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3、

polyimide resin woven glass fabric copper clad laminate

覆铜箔聚酰亚胺玻璃布层压板

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4、

epoxide woven glass fabric copper clad laminate

覆铜箔环氧玻璃布层压板

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5、

The Study on Water based Adhesive ( WP) Used to Laminate Paper and Polymer Film THERMOSETTING RESIN FOR HIGH PERFORMANCE COPPER CLAD LAMINATE

水基冷贴纸塑复合胶(WP)的研制高性能覆铜板用热固性树脂

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6、

based on the market status and technology trend of 2-layer flexible copper clad laminate(2l-fccl), our work focus on lamination technique.

针对二层挠性覆铜板(2L-FCCL)的市场现状和技术发展,我们的工作重点放在压合法。

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7、

copper clad steel wire rod presents with good corrosion resistance, electrical conductivity and mechanical strength, and a becomes better choice of material for messenger and droppers.

铜包钢双金属线材既有良好的导电和抗腐蚀性能,又有较高的机械强度,是一种较好的承力索和吊弦线材。

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8、

cross-linkable polyphenylene ether resin for high performance copper clad laminate

高性能覆铜板用交联性聚苯醚树脂

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9、

New Synthesis Process of Brominized Epoxy Resin for FR-4 Copper Clad Panel

FR-4覆铜板专用溴化环氧树脂合成新工艺

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10、

modified polyhenylene oxide resin woven glass fabric copper clad laminate

覆铜箔改性聚苯醚玻璃布层压板

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11、

High frequency printed circuit basic board-triazine copper clad panel

高频线路板基板&三嗪覆铜板

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12、

Study on PPO/ epoxy glass cloth copper clad laminate

聚苯醚/环氧玻璃布覆铜板的研制

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13、

trial of test methods for bow and twist of as received and after heated cellulose paper and composite copper clad laminates

纸基·复合基覆铜箔板常态及受热后的翘曲测试方法的试用

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14、
15、

Development of non-halogen flame retardent FR-4 copper clad laminates

无卤化FR-4覆铜板开发进展

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16、

Study on Application of Nitrogen-Containing phenolic resin in Halogen-free Copper Clad Laminate

含氮酚醛在无卤覆铜板中的应用研究

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17、

Study of Halogen-free Copper Clad Laminate of Epoxy Resin with Dicyandiamide

双氰胺固化环氧树脂制备无卤化覆铜板的研究

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18、

The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.

论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。

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19、

New Generation High Heat Resistance, High Modulus and Low CTE Copper Clad Laminates

新一代高耐热性、高模量、低CTE覆铜箔层压板材料

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20、

industry: contact; contact pad; copper clad laminate materials; precious metals; non-ferrous metal strip;

所属行业:触点;触片;覆铜板材料;贵金属;有色金属带材;;

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