hypophosphite

Elementary reaction pathways of the reductants such as dimethylamine borane, hypophosphite ion, formaldehyde, and titanium trichloride were quantitatively examined in terms of the heat of reaction.

一些基本的化学反应如：二苯胺硼烷、次磷酸离子、甲醛以及三氯化钛通过计算反应热来定量描述。

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Currently, formaldehyde and sodium hypophosphite are widely used as reducing agent of electroless copper plating, and have high technical maturity. However, considering the problem of environmental factors and plating quality, a more excellent reducing agent is needed urgently.

目前，作为化学镀铜溶液中的还原剂，甲醛和次磷酸钠的应用最为广泛且工艺成熟，可是，考虑到环境因素及镀层质量等问题，亟需寻求一种性能更优异的化学镀铜体系。

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Phosphono-containing maleic anhydride-acrylic acid copolymer as scale inhibitor was synthesized from maleic anhydride ( MA) and acrylic acid ( AA) in water solvent using persulfate-hypophosphite as oxidation-reducton initiator.

以水为溶剂，马来酸酐（MA）、丙烯酸（AA）为单体，过硫酸盐-次磷酸盐氧化还原体系为引发剂，合成马来酸酐-丙烯酸含膦共聚物阻垢剂。

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the high corrosion resistance of the amorphous ni-p alloy deposits is attributed to the phosphorus enrichment on the surface and formation of a protective barrier layer as a hypophosphite anion or a compound ni_2p.

文中还指出，非晶态Ni-P合金高耐蚀的原因，是由于合金表面磷的富集，生成次亚磷酸根阴离子（H2PO2~-）或Ni2P化合物的保护层，使合金进入钝性状态。

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The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed.

探讨了次亚磷酸钠体系化学镀镍沉积机理.

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The optimal technology conditions such as running current, running time, concentration of sodium hypophosphite of electrolytic product of hypophosphorous acid with four-compartment electrodialysis cell applying Ti-Ru anode and stainless steel cathode were discussed.

研究了以钛涂钌电极作为阳极，不锈钢作为阴极，采用四室电渗析槽电解法制备次磷酸的最佳工艺条件（如电解电流、电解时间、原料室次磷酸钠浓度等）。

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The existing bath analyzing methods are compared, as a result a quick and continous method for determining sodium hypophosphite and stannum ( II) ion in electroless tin bath is determined.

并对现有的镀液分析方法进行了比较，确定了快速连续测定化学镀锡液中亚锡离子和次磷酸钠的方法。

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The results showed that the Thiourea and Sodium acetate anhydrous concentration strongly affects the deposition rate and stability of the solution transformed and the following factors are Sodium hypophosphite, Lactic acid, Lead acetate and Nickel ion concentration in solution subsequently.

实验研究的结果显示，硫脲及无水乙酸钠浓度对转化镀液的沉积速度和稳定性都有显著的影响，影响作用次之的是次亚磷酸钠、乳酸、醋酸铅、镍离子的浓度。

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Influence of Maleic Acid on the Deposition Behavior of Sodium Hypophosphite Electroless Copper Plating

马来酸对次磷酸钠化学镀铜沉积行为的影响

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Electrodeposited Ni P composite coatings incorporating a variety of inorganic particles were obtained from Watt's nickel bath containing sodium hypophosphite.

Ni－P复合材料电镀涂层是在溶有次磷酸钠的瓦特镍池中不同无机物颗粒沉淀的混合物。

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Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated.

研究了采用次磷酸钠作还原剂在涤纶织物上化学镀铜.

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The process of hypophosphite electrooxidation on a nickel electrode could be well simulated by this model.

结果表明,该模型能很好地模拟次亚磷酸根在镍电极上的电化学氧化过程.

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