QFN

Thermal Reliability Analysis for QFN based on Factorial Experimental Design

基于析因实验设计的QFN热可靠性分析

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The research in this thesis is supported by the National Natural Science Foundation Project. The structure and dimension parameters of Quad Flat no-lead package ( QFN) devices has been optimized and analyzed.

本文依托于国家自然科学基金项目微电子封装中的界面层裂失效和界面强度可靠性设计方法，对四方扁平无引脚封装（QFN）器件进行了结构尺寸参数优化和分析。

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Reliability sensitivity analysis of the QFN device based on Monte Carlo method

基于蒙特卡罗法的QFN器件可靠性灵敏度分析

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The bonding force between the Cu deposition and substrate can reach 5B grade even after the thermal shock test and the cut by using high-speed grinding wheel of the QFN process.

镀铜层与基底间的结合力可以达到5B级，在经过热冲击试验和QFN封装工艺的高速砂轮线切割操作后，结合力都达到5B级。

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Finite element analysis on soldered joint reliability of QFN device

QFN封装焊点可靠性的有限元分析

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Influence of EMC Material Property Parameters on Thermal Stress of QFN

EMC材料特性参数对QFN器件热应力的影响

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Analysis on Thermal-mechanical Stress and Moisture Driven Delamination in the QFN Package Devices

热–机械应力和湿气引起QFN器件层间开裂分析

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Study on Interface Delamination of QFN under Thermal Shock Loading Based on CZM Method

基于CZM法QFN器件热冲击载荷下的界面脱层研究

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In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.

文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。

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Effects of Moisture on the Reliability of QFN Device in Hygro-Thermal Environment

湿热环境下吸潮对QFN器件可靠性的影响研究

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