1、

This process is joint Lou broke traditional tin soldering shop, greatly reduce the cost of manufacture process, the difficulty, shorten the production cycle, and improve the welding joint intensity.

该工艺打破了娄似接头采用传统的铺锡钎焊方法,大大降低了工艺程难度、制造成本,缩短了生产周期、提高焊接接头的强度。

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3、

Study of Tin Soldering Wire Containing Copper

含微量元素铜焊锡丝的研制

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4、

When soldering ceramic radiating fins on electronic component such as powerful transistors for radio station, the silver film on the fins would be melted together with the tin solder and broken down.

电台用的电子部件如大功率晶体管等与陶瓷散热片焊接时,锡与银会共熔,银层从散热片上脱落。

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5、

The design of absorb tin gun and soldering iron is lightweight, suitable for prolonged use.

吸锡枪及焊铁设计轻巧,适合长时间使用。

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6、

Sn-Cu-Bi Alloy Plating Bath Tin Ball in Reflow Soldering Process Formation

锡-铜-铋合金电镀液回流焊中常见的缺陷&锡珠

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7、

Tin-coat the plug-in contact before soldering.

焊接之前必须给插入式触点涂上锡。

provided by jukuu

8、

industry: reflow soldering machine; soldering machine; electronic components molding machine; tin melting furnace; industrial oven;

所属行业:回流焊接机;焊锡机;电子元件成型机;熔锡炉;工业烤箱;;

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9、

industry: bonder; reflow soldering machine; mounter; tin melting furnace; industrial oven;

所属行业:邦定机;回流焊接机;贴片机;熔锡炉;工业烤箱;;

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10、

industry: electric iron; spot welder; soldering machine; soldering station; tip; tin melting furnace;

所属行业:电烙铁;点焊机;焊锡机;焊台;烙铁头;熔锡炉;;

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11、

industry: soldering machine; reflow soldering machine; industrial oven; tin melting furnace; electronics line; mounter;

所属行业:焊锡机;回流焊接机;工业烤箱;熔锡炉;电子电器生产线;贴片机;;

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12、

the main exhibit name: long-life soldering iron tips, electric soldering iron, tin suction machine.

(生产、经营)产品及类型介绍:长寿烙铁头,电烙铁,吸锡器。

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13、

apply to the high-grade circuit boards wave soldering, welding and hot dip high-grade iron tin wire.

适用于高档电路板的波峰焊、热浸焊和高档引线搪锡。

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14、

the lead-free soldering tin has high electric conductivity, smooth soldering point, less oxidation, no lead and environment friendship.

本技术导电性好,焊点光滑,不易氧化,无铅,满足无铅化的环保要求。

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15、

Apply to factory and individual electronic product soldering tin handle.

适用于工厂及个人电子类产品焊锡作业.

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16、

Terminal pulling force, wire size, tin temperature, soldering temperature, power test.

端子拉力, 线材尺寸, 上锡温度, 焊接温度, 通电测试.

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17、

Soldering Tin Electroplating of copper wire

铜线材电镀可焊性锡工艺

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18、

in the process of soldering, the amount of tin will be reduced constantly.

在波峰焊接过程中,锡的量会不断降低,当降到一定程度时, 应及时添加新的锡条.

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19、

Tin Based Alloy Solder Powder for Free Cleaning Type Soldering Paste

免清洗型软钎膏用锡基合金焊粉

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20、

It involves the considerations of alloy content, tin powder particle and soldering flux type.

选择锡膏要考虑的因素包括合金含量,锡粉颗粒和助焊剂的因型。

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