solder paste的例句大全

Is the upper and lower specification limits for individual Solder Paste height measurements also defined?

单点锡膏厚度测量是否定义了其控制上限和下限?

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Technology Demands and Test Methods of Performance of Solder Paste

焊膏工艺性要求及性能检测方法

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So study lead-free solder paste in the electronic application package is important.

因此研究无铅锡膏在电子封装中的应用具有重要意义。

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The Development of Test Instrument for Solder Paste Print Performance

焊膏印刷性能测试仪器的研制

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In the solder ball test, the performance of solder paste printing was valued on the base of observing solder flux residue and solder ball in the every stage of solder paste printing.

在焊膏焊料球试验中，根据各个阶段焊膏焊料球周围助焊剂残留物和焊球两个方面的表现对焊膏印刷性能进行评价。

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Solder ball test and solder paste wetting test had been done in the every stage of experiments of solder paste printing.

在焊膏印刷性能试验中的各个阶段，进行了焊膏焊料球试验和焊膏润湿试验。

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Polymer Stencil for high Quality and Speed Solder Paste Printing

适合高质量高速度印刷高聚物模版

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Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing

内置无铅锡膏印刷机的检测算法研究

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Research of Evaluation on Printability of Solder Paste

焊膏可印刷性评价方法的研究

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e-class: e-pin, solder paste, circuit boards, scrap wire and cable, components and other plant waste;

电子类：电子脚、锡膏、线路板、废电线电缆、元器件等工厂废料；

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solder paste d g pattern solder resist pattern

防焊區模錫膏模型型

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a well-designed lead-free solder paste will have excellent tack life and the stencil life will be similar to traditional leaded pastes.

良好设计的无铅焊锡膏会具有优异的粘着寿命，模板寿命也将与传统含铅焊锡膏类似。

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apertures with geometrical figure are favorable for printed molding with solder paste.

模板的开口具有几何图形，有利于锡膏的印刷成型。

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the process technology of solder paste printing stencil

漏印焊膏模版的自制工艺

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fine-pitch printing stencil and solder paste

细间距漏印模板与焊膏

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is the cold storage expiration date of the solder paste specified on the solder paste container?

錫膏瓶上是否注明在冷儲藏環境中的過期日期？

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In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.

表面贴装, 钢网是锡膏正确重复印刷的要害.

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Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏.

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Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?

对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?

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We should the adhibit of solder paste before screen printing by automatic machine or by hand.

我们在进行锡膏印刷前应对锡膏进行一定的检测.如果没有专用设备也可以用以下的方法检查一下.

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