plasma cleaning的例句大全

the glc coatings were deposited on aluminum alloy by changing plasma cleaning parameter, the deposited bias voltage and different adhesions.

通过改变等离子清洗工艺参数、沉积负偏压和打底层，优化类石墨镀层在铝合金基体上的性能。

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According to the relationship of thin film thickness and transmittance, we analysis the effect on thickness of thin film layers after plasma cleaning.

1利用膜层厚度与激光透过率的关系，分析等离子体清洗对sol-gel膜层厚度的影响。

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The results from encapsulation peel tests, die and encapsulant pull tests, bonding wire pull tests and C-Mode SAM ( C-SAM) examination are presented. This paper demonstrates that the optimized plasma cleaning process would enhance PBGA package qualification level and improve the process yields and productivity.

陈述了密封剥离试验、芯片和密封剂拉力试验、焊线拉力试验和C-模式SAM（C-SAM）检查的结果，证明了最佳的等离子清洗工艺会增强PBGA封装的定性等级，并提高工艺效率和生产率。

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In order to release the stresses originated from the lattice mismatch and reduce the defect densities, sapphire substrate surfaces are preprocessed by H-plasma cleaning, N-plasma nitriding and the low temperature buffer growth.

为了释放因晶格失配产生的应力，以降低在GaN外延膜中引起的缺陷密度，我们对蓝宝石衬底采用了氢等离子体清洗、氮等离子体氮化以及低温生长缓冲层的方法。

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The Principle and Methods of Cleaning Noxious and Corrosive Gases in Plasma Etching Process

等离子体刻蚀过程中有害气体净化的原理和方法

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the whole blood viscosity ( high and low shearing), plasma viscosity, haematocrit, whole blood reduced viscosity and k value equation were detected with the auto cleaning rotating viscometer.

采用自清洗旋转式黏度计检测高血压患者全血黏度（高、低切）、血浆比黏度、红细胞压积、全血还原黏度和K值方程。

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study on air cleaning technology of nanometer tio_2 catalysis under plasma discharge

纳米TiO2等离子体放电催化空气净化技术的研究

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PLC Control System Built in Large Plasma Bombardment Cleaning Device

大型等离子轰击清洗设备中的PLC控制系统构建

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Radio-frequency atmospheric pressure glow discharge ( RF APGD) cold plasmas have widespread applications in different fields, including plasma-aided etching, deposition, material surface cleaning and ashing, sterilization and biological warfare agents due to the removal of the vacuum system.

大气压射频辉光放电冷等离子体由于摆脱了真空腔的限制，在等离子体辅助刻蚀、灰化、薄膜沉积、材料表面清洗、消毒灭菌、战地生化等领域有着非常广阔的应用前景。

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