1、

Modified atmosphere packaging is a new packaging technology which excels the traditional vacuum packaging and high temperature sterilization packaging.

气调保鲜包装是针对真空包装和高温灭菌等传统包装方法带来的不足而研发的新型包装技术。

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2、

An Investigation of Reactive Ion Etching for Through Silicon Via Packaging Technology

反应离子刻蚀在穿透硅通孔封装技术中的应用研究

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3、

The Ditto Cause and Fresh-keeping and Packaging Technology Research of Fresh Cut Flower

鲜切花凋萎的原因及其保鲜包装技术研究

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4、

New packaging technology for keeping fresh of the vegetables and fruits

蔬菜水果保鲜包装新技术

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5、

Along with the development of modern design and packaging technology, external test can't meet the needs.

随着现代设计和封装技术的发展,外部测试变的越来越不适应。

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6、

With development and updating of synthesis and packaging technology, organic luminescent materials are interruptedly used in the field of electroluminescence.

随着合成与组装技术的发展与更新,有机发光材料也不断被应用到电致发光领域中。

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7、

starting from an introduction of modified atmosphere packaging ( map) technology this paper analyzes where the key of vegetable and fruit packaging technology lies.

从自然气调包装(MAP)技术原理的介绍出发,分析了果蔬食品包装的技术关键。

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8、

Chip scale package ( CSP) is a new microelectronic packaging technology rapidly deve-loped in recent years.

芯片尺度封装(CSP)技术是近年来发展最为迅速的微电子封装新技术。

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9、

This paper presents all kinds of microsystem packaging technology which have appeared since the nineties of the 20th century.

介绍了20世纪90年代以来出现的几种微型封装技术。

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10、

Study of Fiber Bragg Grating Packaging Technology on Temperature Sensitivity and Temperature Compensation

光纤光栅温敏与温度补偿式封装技术的研究

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11、

With the development of electronic packaging technology, packaging pin number increasing, lead spacing smaller, encapsulated in the substrate of the area will be smaller.

随着电子封装技术的发展,封装引脚数越来越多,引线间距越来越小,封装体在基板上所占的面积也会更小。

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12、

The New Evolution of Consumer Electronics and Application of Packaging Technology

消费电子产品发展趋势及封装技术的应用

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13、

Features and Development on Tamper-Evident Packaging Technology

显窃启包装技术的特点及开发

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14、

Packaging Technology of Infrared Detector on Satellite And Its Application

星用红外探测器封装技术及其应用

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15、

The microelectronics packaging technology is developed to be thinner and smaller with the new technique of stacked chip package, while it also brings the challenge of low-loop for the thermosonic wire bonding process.

叠层封装技术满足了微电子封装向轻薄小发展的趋势,同时热超声键合技术的低弧大跨度带来了新的挑战。

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16、

Packaging Technology for Fresh fruit and Vegetable and Its Research Progress in Modern Logistics

现代物流中果蔬保鲜包装技术及其研究进展

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17、

The conversion to lead free is the trend in electronic packaging technology.

电子产品向无铅化转变是大势所趋。

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18、

Research on the transfusion solution packaging technology

输液包装技术研究

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19、

New Progress of Electronic Packaging Technology

电子封装技术的新进展

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20、

objective to research the effect on the stability of mint oil with different packaging technology.

目的研究不同包装工艺对薄荷挥发油稳定性的影响。

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