package technology的例句大全

Dependable Package Technology of PIN Photodetector Base

高可靠性PIN光电探测器底座封装技术

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The modular design and package technology of matrix software and the synchronization function between master and spare card can meet the need of the most important stability. So, this system can provide better service in radio stations.

矩阵软件采用模块化封装设计，主备卡同步功能很好的解决了系统最重要的稳定性需求，能够较好地满足广播电台的需要。

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it can thus offer its customer complete, one-stop solutions. bosch package technology ( hangzhou ) co.

博世包装技术可以给客户提供度身订制的完整的解决方案.

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And it had a near-death experience in1993 before Lou Gerstner realised that the best way to package technology for use by businesses was to focus on services.

而它在1993年一度濒临死亡，直到郭士纳（Lou Gerstner）意识到打包技术供企业使用的最好的方法是把重点放在服务上。

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CSP Causes the Revolution of Memory Chip Package Technology

CSP引发内存封装技术的革命

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The current situation and future of memory chip package technology are introduced in the paper.

本文主介绍了国际上内存芯片封装技术的现状以及未来的发展等。

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And it had a near-death experience in 1993 before Lou Gerstner realised that the best way to package technology for use by businesses was to focus on services.

而它在1993年一度濒临倒闭，直到郭士纳（Lou Gerstner）意识到打包技术供企业使用的最好的方法是把重点放在服务上。

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High Density and High Performance Electronic Package Technology

高密度高性能电子封装技术

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In order to overcome the bottleneck of the 2-D package technology, a three-dimensional ( 3-D) package technology has been proposed.

为了克服平面封装技术的瓶颈，人们开发了一种三维封装技术，即叠层封装。

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Microelectronic Package Technology of Striding Forward New Millenary

迈向新世纪的微电子封装技术

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New processing technology of wet instant noodle with soft package

即食软包装鲜面条生产新工艺

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Proposed one kind error-resilience algorithm combined conditional ARQ with layered coding. Through calculates video loss quantity after error concealment at the decoding end, decided whether need to use ARQ technology retransmitting damage video package of basic level.

提出一种有条件ARQ分层编码方法，根据解码端错误掩盖后的视频损失量，决定是否需要采用ARQ技术重传受损的基本层视频。

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Package Design Vs Trade Technology Barrier

包装设计与贸易技术壁垒

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Chip scale package ( CSP) is a new microelectronic packaging technology rapidly deve-loped in recent years.

芯片尺度封装（CSP）技术是近年来发展最为迅速的微电子封装新技术。

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Later, the heat performance of LED package utilizing chip-on-board technology on a novel composite materials with high thermoconductivity was studied. Investigation on Medium-temperature Radiant Panels, Skirt-type Radiator 、 Plinth-type Radiator and Their Indoor Thermal Behaviors

最后分析了LED芯片采用chip-on-board技术封装在新型高热导率复合材料散热板上的散热性能。热膜型中温辐射板及裙型、踢脚线型散热板室内热环境研究

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Technology of Cold Storage and Package in Oil Nace

油柰果实冷藏保鲜及包装技术研究

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This article introduces basic knowledge of computer graphics that is related to 3D model and movies, and then introduces the technology of OpenGL that is a program software package.

本文首先介绍了用于支持三维建模与动画的计算机图形学基本知识，以及专门的三维编程软件包OpenGL。

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Small tilapias were selected to develop the processing technology of soft package tomato sauce tilapia can.

主要探讨茄汁罗非鱼软包装罐头的加工技术，着重就茄汁罗非鱼腌制、油炸条件、调味配方的筛选和杀菌条件进行研究。

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Resonant pressure sensors are fabricated by IC process and MEMS technology and bonded to a stress isolating mechanical structure and sealed into an evacuated package.

芯片利用半导体IC工艺和MEMS工艺制作，采用一种减小封装应力的结构，完成压力传感器的真空密封及封装。

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As the main technology to implement SOA, Web service is gradually becoming the standard way to package network resources.

Web服务作为SOA的主流实现方式，正逐步成为网络环境中资源封装的标准方式。

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