lead-free的例句大全

In many sectors of the electronic industry, lead-free assembly seems inevitable.

对许多电子工业部门来说，无铅集成将是必然趋势。

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Research Progress and Development Tendency of Tin-based Lead-free Electronic Solder

锡基无铅电子焊料的研究进展与发展趋势

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Effect of Lead-Free Soldering Technology on the Reliability of PCB

无铅焊接技术对印制电路板可靠性的影响

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And specific properties for several kinds of lead-free solder are analogized.

分析了几类正在实用化的无铅焊料特性.

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Relationship Between Quality and Capability of Lead-free Solder Powder

无铅焊锡微粉雾化量与性能的关系

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Review of JIS Z 3198: Test Method for Lead-free Solders

JIS Z3198无铅钎料试验方法简介与评述

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Fracture mechanism of lead-free soldered joints of rectangular chip component

矩形片状元件无铅焊点断裂机制

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Proprietary oil-based lead-free stoppers are available.

可提供专用油无铅堵塞物。

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Advances of Lead-Free Flexible Piezoelectric Composites

无铅柔性压电复合材料进展

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lead-free pigment, titanium yellow, transparent iron oxide, colourant;

无铅颜料、钛黄、透明氧化铁颜料、色浆；

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during lead-free soldering, the oxidation rate is very high, so it is preferable to use nitrogen protection.

因为在进行无铅焊接的时候，无铅锡很容易被氧化，所以炉体内需要氮气进行保护。

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nitrogen protection is used in practical industry because of poor wettability of lead-free solder.

由于无铅钎料润湿性较差，在实际生产中普遍采用氮气保护。

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nitrogen protection's effect on solder joint appearance in lead-free reflow soldering

氮气保护对无铅再流焊焊点外观质量的影响

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a well-designed lead-free solder paste will have excellent tack life and the stencil life will be similar to traditional leaded pastes.

良好设计的无铅焊锡膏会具有优异的粘着寿命，模板寿命也将与传统含铅焊锡膏类似。

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preparation and performances of niobate-tantalate lead-free piezoelectric ceramics

铌钽酸盐无铅压电陶瓷的制备与性能

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in the paper all the processes of lead-free wave soldering were analyzed, a great deal of experiments were done by doe, many of soldering defects due to process were analyzed by spc and the best lead-free wave soldering processes were made.

通过分析无铅波峰焊接的各个工艺参数，运用DOE方法进行大量的试验，采用统计学原理分析产生各种缺陷的工艺因素，并确定优化的无铅波峰焊接工艺。

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new development on lead-free sealing glass of phosphate system

无铅磷酸盐封接玻璃的最新进展

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displacement of dimethyl benzene by number 97 lead-free gasoline in water extractor

97#无铅汽油取代二甲苯在脱水机中的应用

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the surface mount joint strength and melting range of lead-free solders

表面封装用无铅软钎料的接头强度及熔点范围的研究

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the methodologies for free drop test and bending test are introduced, considering the important effect of mechanical stress on the reliability of lead-free bga packaging.

着重研究了机械冲击和应力对无铅BGA封装焊点可靠性的影响，介绍了BGA封装的可靠性力学试验（跌落、弯曲试验）及其分析方法。

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