lead frame的例句大全

The copper alloy strip of lead frame is the fundamental material for integrate circuit.

引线框架用铜带是集成电路的重要基础材料。

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Copper alloy which has high strength and high conductivity is a kind of important function material. And it is extensively applied to the down-lead frame of integrate circuit, the head of resistance welding, the trolly wire of electric engine and so on.

高强度高导电率铜作为一种重要的功能材料广泛应用于集成电路引线框架、电阻焊、电气机车架空线等。

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Dual in line lead frame Hard-drawn aluminium wire for overhead line conductors

双列直插式引线框架GB/T17048-1997架空绞线用硬铝线

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Attraction type LLM dual in line lead frame

吸引型直线悬浮电动机双列直插式引线框架

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Dual in line lead frame quad flat package

双列直插式引线框架四列直插式扁平外壳

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application requirements for lead frame used for ic plastic encapsulation

集成电路塑封中引线框架使用要求

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Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

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COB type LED has the lower thermal resistance than lead frame . Metal substrate appropriate power package.

COB型LED有 较支架低的热阻系数. 是照明用LED最合适之封装结构.

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Numerical analysis of surface flaking in finish rolled lead frame copper alloy

引线框架铜合金精轧薄板表面起皮剥落的数值分析

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The heavy gauge lead frame is made of oxygen-free copper.

大尺寸引脚框由无氧铜制成.

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The punching process of the lead frame was analyzed, the multi-position progressive die was designed.

分析了引线框的冲压工艺性, 设计出了 多工位 级进模.

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The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.

引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。

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making an approach to annealing technology of finished products of ic-lead frame materials

集成电路引线框架材料成品退火工艺探讨

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microstructure and capability research of kfc lead frame

KFC引线框架材料组织性能研究

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kfc copper alloy is one of the representative lead frame materials with good electric conductivity.

KFC合金是具有代表性的高导电引线框架材料之一。

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lead bonding lead frame bonding tape automated bonding, tab

引线框式键合带式自动键合激光键合

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Market analysis of domestic lead-in frame copper strips

国内引线框架铜带市场分析

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Following her lead, I strapped on a pair of lightweight, aluminum-framed snowshoes and began awkwardly high-stepping on top of the packed powder.

由她领路，我系上一双轻质铝架的雪鞋，踉踉跄跄地开始在皑皑白雪上行进。

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This inevitably lead to mang disadvantageous factors, such as fallacious frame of the mould, unstable cast quality, longer period of mould design and higher cost, etc.

这就不可避免地造成模具结构不合理、铸件质量不稳定、铸造模具的设计周期长、成本高等不利因素，有时甚至出现因事前设计考虑不周，导致原设计方案推倒重来的现象。

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Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

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