1、

A New Method to Code Non-circle Molecules: CMP Algorithm

对无环分子编码的一个新方法:CMP法

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2、

The tightly-coupled nature of the CMP allows very short physical distances between processors and memory and, therefore, minimal memory access latency and higher performance.

CMP紧密耦合的本质使处理器与内存之间的物理距离很短,因此可提供最小的内存访问延迟和更高的性能。

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3、

Tightly-coupled multiprocessing refers to chip-level multiprocessing ( CMP).

紧密耦合多处理指芯片级多处理(CMP)。

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4、

Research on CMP power estimation model Quantitative Evaluation of the Cryptographic Block's Resistibility to Power Analysis Attack at Different Design Level

单芯片多处理器结构功耗评估方法研究不同设计层次下密码运算部件抗功耗攻击能力量化评估技术

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5、

The chemical reaction by organic alkali with by hydroxide radicle and double amidocyanogen was analyzed in Cu-CMP process.

分析了带有羟基和双胺基的有机碱在Cu-CMP过程中的化学作用。

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6、

Zero offset ( ZO) section, which is just the goal of CMP stacking in conventional processing, is an important intermediate result in seismic reflection imaging.

零炮检距剖面是地震反射成像过程中重要的中间成果,常规处理中的共中心点(CMP)叠加的目的正在于此。

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7、

A typical CMP ( Chip Multi-Processor) architecture often has a shared L2 cache and lower storage hierarchy. Sharing the L2 cache allows high cache utilization and avoids duplicating cache hardware resources.

在典型的多核处理器(CMP,Chip multi-Processor)体系结构中,多个处理器核共享二级高速缓存,这种方式不仅能够提高高速缓存的利用率,还能避免存储器硬件资源的浪费。

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8、

Design and Implementation of BCI Parallel Algorithm on CMP

基于CMP的脑机接口并行算法的设计与实现

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9、

Study on kenaf xylem alkaline sodium sulfite pretreatment CMP for newsprint

红麻木质部碱性亚钠预处理化机浆抄新闻纸的研究

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10、

Preparation of CMP by Liquid Fermentation for Poria cocos and Research on Its Viscosity

茯苓液态发酵法中CMP的制备及黏度特性的研究

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11、

CMP has the function of indirect antivirus, protecting the liver and lulling.

CMP具有间接抗病毒、保肝与催眠作用。

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12、

Ultrafiltration treatment of CMP effluent was studied.

对超滤法处理化机浆(CMP)废水进行了研究。

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13、

Zone Back pressure Control Using for Vacuum Carriers in CMP

CMP加工中的真空吸盘区域压力控制技术

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14、

A Study on Mechanisms for Chemical Action of Tungsten Plug in CMP

钨插塞在化学机械抛光中的化学作用机理研究

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15、

Silicon dioxide nanoparticles have been widely used in chemical mechanical polishing ( CMP), coating material, rubber, binding agent, biology, iatrology, catalyst and other fields for their excellent properties.

纳米SiO2以其独特的性能已广泛地应用于化学机械抛光(Chemical Mechanical Polishing,CMP)以及涂料、橡胶、粘合剂、生物、医学、催化剂等其他众多领域。

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16、

Therefore, the influence parameters aiming at CMP process and their effects to polishing result need to be researched deeply.

抛光垫作为CMP系统的重要组成部分,其性能直接影响CMP过程及抛光效果。

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17、

Study on Flows and Temperature Distribution of CMP Process; Effect of EMBr on Fluid Flow and Temperature during Continuous casting

化学机械抛光的流动性能和温度场的计算电磁制动对结晶器流场以及温度场影响的研究

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18、

This process goes round and round, and copper CMP was finished.

这样新鲜的铜表面在浆料的作用下继续被氧化,机械磨除、络合,反应产物被湍流的浆料带走,周而复始,完成铜的CMP过程。

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19、

For CMP gather seismic data, in common midpoint-half offset distance, the prestack double square root operator could be used to continuate and strip layer by layer.

对于CMP道集地震数据,在共中心点-半偏移距中,可以利用波动方程的叠前双平方根算子,实现延拓,进行层层剥离。

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20、

The tsinghua university project of embedded microprocessor design is a major national 863 program; CMP is its extended project.

清华大学嵌入式微处理器芯片设计为国家重点863项目,单芯片多处理器设计为项目的一个延伸。

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