AG的例句大全

The semi-bright Ag-RE ( silver-rare earth) composite deposits have the properties of higher hardness and wear resistance, greater adhesive strength, higher tarnish resistance, as well as lower porosity and lower contact resistance than pure silver plating layers.

这种银&稀土（Ag-RE）复合镀层比镀银层硬度高、耐磨，结合力和抗变色性能强，而且孔隙率和接触电阻都较低。

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The structure and electronic state of the ordered thin film of perylene and tetracene on Ag ( 110) surface

有机半导体perylene和tetracene在Ag（110）表面上有序薄膜的结构与电子态研究

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Both Ag 3d and C 1s core levels in XPS measurements showed almost no shift, indicating that the interaction between tetracene and the Ag substrate is relatively weak.

XPS测量显示Ag3d和C1s谱峰几乎没有位移，表明tetranece与衬底Ag之间相互作用弱。

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Studies on the Curing Process of Tetrafunctional Epoxy Resin ( Ag-80)/ Sulfone Ether Diamines by Torsional Braid Analysis

TBA技术研究四官能环氧树脂（Ag-80）/砜醚二胺（SED）的固化过程

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Research on the Sythesis of New Silver Cluster Complexes by the Insertion Reaction of CS_2 into Ag& S Bonds(ⅳ) Formation and Crystal Structure of a Tetranuclear Silver Cluster Complex ( Ph_3P)_4Ag_4Br_4

应用CS2在Ag S键中的插入反应生成新型Ag原子簇化合物的研究Ⅳ四核银簇合物（Ph3P）4Ag4Br4的形成与晶体结构

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Ag-type antibacterial agent and its application in the textile material

银系抗菌剂及其在纺织材料中的应用

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CLAREX NON-GLARE ( AG) SHEET protects the display with excellent optical characteristics, contrast enhancement, screen glare reduction and complete UV protection.

能够以优良的光学特性减少屏幕反光，防紫外线等来保护显示屏。

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Investigation on Oxidation Mechanism of Ag-Sn Alloy and High Temperature Plastic Deformation Behaviour of Ag-SnO_2 Materials

Ag-Sn合金氧化机理与Ag-SnO2材料的高温塑性变形行为研究

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The experimental results show that positive temperature coefficient of resistance and breakdown voltage increase, but the resistivity of PTCR ceramics at room temperature changes little when appropriate Ag doped.

结果表明，适量的Ag掺杂对材料的室温电阻率（r）影响不大，并且还可以有效提高PTCR陶瓷的温度系数（aR）和耐电压（Vb）。

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Investigating the stability of Au-Ag bimetal at different pH and temperature conditions.

考察合金纳米颗粒在不同pH，不同温度条件下的稳定性。

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Ag_2O doping reduces the static thermal corrosion rate in cryolite melt and enhances the high temperature conductivity.

Ag2O的加入在不提高试样在冰晶石熔盐中的静态热腐蚀速率的前提下，提高了试样的高温电导率。

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Nowadays most of factory use co-fired process, namely using the same temperature to fire front Ag and BSF.

现在大规模生产过程中普遍采用共烧来进行生产，即背场和正面银浆使用同一温度共同进行烧结。

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The electrical properties of films were measured in temperature modulated mode and in simple temperature ramp mode. The results are used to evaluate the effects of Ag addition, environmental humidity and O 2 partial pressure on the electrical properties of SnO 2 thin films.

用温度调制方式和锯齿波加热方式研究了薄膜的电学特性，讨论了银催化剂、湿度及氧分压对SnO2电学特性的影响。

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The Curie's temperature Tc and saturation magnetization decreased obviously by Sr substituted with Cu or Ag and Sr2+ vacancy in the samples, while the initial susceptibility is increased.

通过用Cu或Ag部分替代Sr和少量Sr空位，使样品的居里温度和比饱和磁化强度比替代前的La（0.67）Sr（0.33）MnO3材料显著降低，而起始磁化率反而增加。

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Two Temperature Traverse Sections of Ag-Cu-Si Trinal System

Ag-Cu-Si合金系的两个变温截面

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Template synthesis of Ag ordered nanowire arrays

模板法合成Ag纳米线阵列

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Effect of Ag on tensile fracture of natural aged al-li-cu-mg-zr alloy

微量Ag对自然时效态Al-Li-Cu-Mg-Zr合金低温拉伸行为的影响

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Resistance to softening, the effects of alloy elements and microstructures of Cu-0.1% Ag-0.06% Ce and Cu-0.1% Ag-0.1% Cr alloys were analyzed and compared with Cu-0.1% Ag alloy, by using hardometer, electronic tensile testing machine, optical microscope and TEM, etc.

采用显微硬度计、电子拉伸试验机、光学显微镜和TEM等，通过与Cu-0.1%Ag合金对比，分析了Cu-0.1%Ag-0.06%Ce合金和Cu-0.1%Ag-0.1%Cr合金的抗软化性能、合金元素的作用及组织形貌特征。

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The effect on the microstructures of the brazing seam of Ag-CdO contact terminal and Cu contact bridge by different brazing technological parameters including temperature, holding time and joint gap was analyzed. Based on the analysis, the optimum technological criteria put forward.

分析了Ag-CdO触头与Cu触桥钎焊温度、保温时间、钎焊间隙对钎缝组织的影响，并提出了获得理想组织的最佳工艺规范。

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700 ℃ isothermal section of Ag Pd Ru ternary phase diagram

Ag-Pd-Ru三元系相图的700℃等温截面

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