The model can cooperate smoothly with the PIV and pressure sensor to detect the velocity, TSS and wall pressure;

1、

Resonant pressure sensors are fabricated by IC process and MEMS technology and bonded to a stress isolating mechanical structure and sealed into an evacuated package.

芯片利用半导体IC工艺和MEMS工艺制作，采用一种减小封装应力的结构，完成压力传感器的真空密封及封装。

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2、

The Application of Silicon-to-Silicon Direct Bonded Technology to Fabricate Pressure Sensors

应用SDB技术制造压力传感器

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3、

PVDF soil pressure sensor

PVDF土压力传感器

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4、

Under automatic control mode, the PLC judges whether opened or stopped the pressure pumps by the pressure signal which provided by hydraulic pressure sensor.

自动控制时，PLC根据进水压力传感器提供的压力信号，判断是否启、停加压泵。

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5、

Research on SOI Pressure Sensor Packaging Process

SOI压力传感器封装工艺研究

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6、

An MOS Flip-Flop Pressure Sensor IC

MOS触发器型集成压力传感器

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7、

High Temperature Pressure Sensor Fabricated with Smart Cut SOI Materials

智能剥离SOI高温压力传感器

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8、

An Integrated MOS Ring Oscillator Pressure Sensor with Silicon Box Structure

硅盒结构集成MOS环振式压力传感器

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9、

Based on the Temperature Compensation Bragg Grating Pressure Sensor and Signal Processing Research

基于温度补偿的Bragg光栅压力传感器及其信号处理研究

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10、

The Study of the Optical Fiber MEMS Pressure Sensor with a Mesa Structure Diaphragm

台面结构硅基法珀型光纤MEMS压力传感器的研究

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11、

A Batch Microassembly System for Fabrication of MEMS Pressure Sensors

MEMS压力传感器批量组装设备的研制

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12、

Development of dual-E form pressure transducer

双E形结构硅压力传感器的研制

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13、

Design of C-type Pressure Sensors

C型压力传感器的设计

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14、

Analysis of structural deviation of C-type piezoresistive pressure sensors using the finite element method

压阻式压力传感器C型结构偏差的有限元分析

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15、

Methods The physical parameters of blast wave were measured by PCB pressure transducers ( USA) during underwater and air explosions of 200g, 500g and 1000g TNT respectively. Consequently, the propagation speed, peak overpressure value, positive duration and impulse of blast wave were analyzed.

方法分别用200、500和1000g TNT进行水下和空气中爆炸，用美国PCB公司生产的压力传感器测定冲击波物理参数，分析冲击波的传播速度、超压峰值、正向持续时间和冲量。

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16、

A Data System with SYD Pressure Transducers

SYD压力传感器数据系统

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17、

Controlling and data processing of GPS OEM card by PDA based on windows CE

基于WINDOWS CE掌上电脑对GPS OEM板的控制和数据处理

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18、

Analysis and Solution of Scraps-Bounce in Progressive Die Stamping for Computer Case Septum Board

电脑箱勾板级进模废料上跳问题的分析与解决

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19、

Study on the Metals in PWB of Waste Computers

废旧电脑印刷线路板金属成分溶出的试验研究

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20、

Application Study on encapsulating material for computer reset circuit board

电脑复位电路板灌封材料与应用研究

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